JPH0632686Y2 - 半導体チップ用ウェハの取付け装置 - Google Patents
半導体チップ用ウェハの取付け装置Info
- Publication number
- JPH0632686Y2 JPH0632686Y2 JP1988158689U JP15868988U JPH0632686Y2 JP H0632686 Y2 JPH0632686 Y2 JP H0632686Y2 JP 1988158689 U JP1988158689 U JP 1988158689U JP 15868988 U JP15868988 U JP 15868988U JP H0632686 Y2 JPH0632686 Y2 JP H0632686Y2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- support member
- magnet
- pressing
- force
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title claims description 3
- 238000003825 pressing Methods 0.000 claims description 37
- 235000012431 wafers Nutrition 0.000 description 58
- BGPVFRJUHWVFKM-UHFFFAOYSA-N N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] Chemical compound N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] BGPVFRJUHWVFKM-UHFFFAOYSA-N 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Jigs For Machine Tools (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988158689U JPH0632686Y2 (ja) | 1988-12-06 | 1988-12-06 | 半導体チップ用ウェハの取付け装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988158689U JPH0632686Y2 (ja) | 1988-12-06 | 1988-12-06 | 半導体チップ用ウェハの取付け装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0279036U JPH0279036U (en]) | 1990-06-18 |
| JPH0632686Y2 true JPH0632686Y2 (ja) | 1994-08-24 |
Family
ID=31439240
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988158689U Expired - Fee Related JPH0632686Y2 (ja) | 1988-12-06 | 1988-12-06 | 半導体チップ用ウェハの取付け装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0632686Y2 (en]) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6287385B1 (en) * | 1999-10-29 | 2001-09-11 | The Boc Group, Inc. | Spring clip for sensitive substrates |
| CN116061323B (zh) * | 2022-12-28 | 2025-08-22 | 大连连城数控机器股份有限公司 | 一种用于硅棒的取样装置及其下料系统 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5844848U (ja) * | 1981-09-21 | 1983-03-25 | 日本電気株式会社 | 半導体ウエハ−固定用治具 |
-
1988
- 1988-12-06 JP JP1988158689U patent/JPH0632686Y2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0279036U (en]) | 1990-06-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |